Primary Objective: The Equipment Engineer will own all assigned toolsets. The preferred candidate will have the ability to troubleshoot difficult and poorly defined problems in relation to the mechanics, electronics, and process using tool knowledge/experience, FDC, SPC, schematics, and other available resources. The candidate will have extensive collaboration with the area maintenance team and process engineering. Some collaboration will be with tool vendors, other area engineers/managers, procurement, and production. Major Areas of Accountability for the Equipment Engineer: Provide technical leadership and management of 200MM Semiconductor processing equipment in at least one of the following areas: PVD and CVD Thin Films, Dry Etch, Diffusion, Photolithography, or Metrology (some areas may be combined). Work with module process engineering and equipment maintenance technicians to drive root cause corrective actions of equipment failures, implement permanent solutions and eliminate chronic and long-term down events. Develop and implement equipment upgrades to increase capacity, lower costs and improve yields. Lead continuous improvement teams to drive tool matching, availability, throughput improvements and reduce risk. Work with minimal supervision, balancing competing priorities, to serve the needs of the Module, Maintenance and Production organizations. Participate in cross-functional teams that create efficiencies across all layers of the organization.