Job Description

We are seeking a talented and driven Process Engineer specializing in Chemical Mechanical Planarization (CMP). Your role will involve enabling and accelerating technology deployment into head products to meet HDD new product requirements throughout the product life cycle. This position requires flexibility to work a five-day schedule, including weekends.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• CMP Process Engineer in a high-volume 24x7 wafer fabrication environment that is responsible for maintaining key parameter control within tight specifications for both manufacturing and development wafers.
• The responsibilities consist of but not limited to: wafer data review and disposition; create and modify recipes and set up APC on various CMP tools; communicate to primary process/metrology/integration engineers and production line; understand the application and reliability of metrology tools such as AFM, topography, SEM/FIB/TEM, etc.
• Partner with process development engineers and technicians responsible for CMP new process development, methodology setup, consumables, and advance tooling delivery to meet new product launch requirement, schedule, and manufacturability.
• Responsible for new process manufacturing transferring from DEV team and ramping up in production, support necessary new process implementing.
• Work with cross functional teams including development, design, integration, and other process modules on designs incorporating CMP or resolving any integration issue.
• Lead on trouble-shoot the related issues in production line, conduct defect analyses, root cause analyses, and implement corrective and preventive actions.
• Lead projects to improve process capability of WIW and WTW sigma, reduce cycle time, costs and defects, increase throughputs and line yield.

Qualifications

REQUIRED:

• MS, or PhD degree in physics, chemistry, chemical engineering, materials science, or a related engineering field.
• Understanding microelectronics wafer fabrication process including CMP, photolithography, dry or wet etching, electroplating, or thin film deposition processes.
• Possess manufacturing process engineering mindset, ability to work in a high-pace dynamic environment, and ability to multi-task.

PREFERRED:

• Experience in wafer-level magnetic recording head fabrication is desirable.
• Strong hand-on experience and willing to work in wafer fab.

SKILLS:

• Strong background and experience in statistical data analysis and 6-sigma methodologies.
• Excellent communication skills, both written and oral. Able to work on the resolution of any issue and to interact with various interdepartmental team and support organizations.

Working Hours:

• 5-day workweek, including one or two weekend days.