Senior Photonics Packaging Engineer, Taara

Hardware Engineering

Mountain View, CA (HQ)

About the Team:

Project Taara focuses on increasing access to abundant and affordable internet with beams of light (Wireless Optical Communication). Like fiber, but without the cables, Taara uses wireless optical communication to transmit data at super high speeds through the air as a very narrow, invisible beam. Taara has helped bridge a particularly stubborn connectivity gap between Brazzaville (Republic of Congo) and Kinshasa (Democratic Republic of Congo) across the Congo river. More on this topic is available here.

About the Role:

The successful candidate will design and implement packaging solutions for micro-optic assemblies of Si photonic and III-V dies at outsourced semiconductor assembly and test vendors. The role requires deep knowledge in photonic packaging design, simulation, optimization, assembly and testing. The position seeks highly-motivated individuals who thrive in ambiguity and enjoy working in a small dynamic team environment, with a passion for solving challenging problems that can lead to high-impact advances in technology.

How you will make 10x impact:

• Develop and implement novel photonic assembly and packaging.

• Optimize assemblies for manufacturability and reliability.

• Contribute to system-level optimization and product strategy.

• Be motivated by making the world a better place through technology, and wanting to be part of a team that makes this happen.

What you should have:

• M.S. in Electrical Engineering, Applied Physics or related field

• Five (5) or more years relevant industry experience with demonstrated achievements in photonic packaging

• Experience with optical simulation software (Zemax, Lumerical, Flexcompute or equivalent)

• Experience with thermo-mechanical simulations (Ansys, Altair, Siemens, or equivalent).

• Experience with optimization of packaging towards manufacturability and reliability.

• Experience working with outsourced semiconductor assembly and test vendors.

• Experience with failure analysis, parts inspection and testing.

It would be great if you also had these:

• Ph.D. in Electrical Engineering, Materials Science, Applied Physics or related field

• Experience with microelectronic assembly processes such as 3D and 2.5D assemblies

• Excellent communication and presentation skills (writing and delivering presentations), can work with senior external partners with ease.

• Hands-on experience in advancing product from prototype to final production stage

The US base salary range for this full-time position is $142,000 - $200,000 + bonus + equity + benefits. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.

At X, we don't just accept difference - we celebrate it, we support it, and we thrive on it for the benefit of our employees, our products and our community. We are proud to be an equal opportunity workplace and is an affirmative action employer. We are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender identity or Veteran status. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements.

If you have a disability or special need that requires accommodation, please contact us at:x-accommodation-request@x.team.